Innovative Method Integrates Electronics During FDM 3D Printing

Combining electronics with 3D-printed structures typically involves manual assembly. However, the Print & Place approach, demonstrated by Oliver Child et al. in their research article titled Print & Place: Using a 3D printer for Continuous Assembly of Electronic Devices, offers a more integrated solution.

An accompanying video provides an overview of how a standard Fused Deposition Modeling (FDM) printer can be utilized to embed electronic components without modifications. The method uses thermoplastic as a temporary adhesive to pick up parts from a printed tray located elsewhere on the build plate.

This tray is created parametrically before printing begins. An operator populates the tray with necessary components, allowing the print head to pick them up during the printing process. Regular G-code commands direct the print head to the required part, where it uses extruded plastic to adhere to and lift the component.

Once lifted, these components can be fully embedded by printing over them. This method supports various parts, including small pre-populated PCBs, conductive wire strips, and rivets for creating connections between conductive traces.

As an open-loop system, this method may encounter typical challenges such as pick failures, placement misalignment, and contact inconsistencies, which the authors noted during their experiments. To address these issues, the authors suggest incorporating a camera system similar to those found in traditional pick-and-place machines, which could provide feedback for adjustments and assist the operator.

Source: Hackaday